War Hammer - Thermal Pad Raptor Ultra (100x100x0.5mm) Thermal Pad
War Hammer - Thermal Pad Raptor Ultra (100x100x0.5mm) Thermal Pad Original price was: ₹2,999.00.Current price is: ₹949.00.
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War Hammer - Thermal Pad Raptor Ultra (100x100x1.5mm) Thermal Pad
War Hammer - Thermal Pad Raptor Ultra (100x100x1.5mm) Thermal Pad Original price was: ₹3,999.00.Current price is: ₹1,149.00.

War Hammer – Thermal Pad Raptor Ultra (100x100x1mm) Thermal Pad

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Original price was: ₹3,499.00.Current price is: ₹1,049.00.

Only 1 left in stock

Only 1 left in stock

SKU: WH-TPR-100-100-1 Category: Brand:

Description

Key Specifications & Features

  • Thermal Conductivity: High thermal conductivity rated at 12.0 W/m·K for fast heat transfer and lower operating temperatures.
  • Electrical Safety: Electrically non-conductive and non-corrosive, eliminating short-circuit risks around sensitive circuitry, pins, and leads.
  • Compressibility & Gap Filling: Highly compressible and conformable material that easily molds to irregular surfaces and varying component heights.
  • Long-Term Durability: Engineered to resist drying, hardening, degradation, and pump-out over time with zero bleeding/oil leakage.
  • Sheet Dimensions: 100 × 100 mm sheet, easily trimmable using a hobby knife or scissors.
  • Thickness:- 1.0 mm (Small gap)

Recommended Applications

Ideal for filling gaps between heat-generating electronic components and heatsinks:

  • VRMs / MOSFETs: Power delivery sections on graphics cards and motherboards.

  • VRAM / GPU Memory: Fast heat transfer for high-performance memory chips.

  • M.2 SSD Controllers & NAND: Helps maintain optimal sustained read/write speeds without thermal throttling.

  • Motherboard Chipsets: Keeps platform controller hubs thermally stable.

  • Laptop Cooling Modules: Suitable for dense heat-pipe assemblies and cramped thermal designs.

  • General Electronics: Power supplies, LED drivers, and other uneven high-heat components.

Important Usage Note:

DO NOT USE DIRECTLY ON CPU OR GPU DIES. This pad is engineered specifically for component gap-filling applications (VRMs, memory, chipsets, SSD controllers). Direct bare-die cooling requires thermal paste or phase-change material.

Installation Overview

  1. Clean the Surface: Thoroughly remove old thermal paste, pads, dust, and oils using the included wet and dry wipes.

  2. Measure the Gap: Check clearance between heatsink and component to select the proper pad thickness.

  3. Cut to Size: Measure and slice the pad to fit component dimensions.

  4. Apply Pad: Position over the component ensuring full coverage.

  5. Secure Heatsink: Reinstall heatsink using even screw pressure. (If no heatsink is present, the pad can remain uncovered to radiate heat into the chassis).

Specifications

BrandWar Hammer
Size100mm x 100mm
Thickness1mm
Pack of1